Customization: | Available |
---|---|
Transport Package: | Wooden Case |
Specification: | 3100*1330*1450mm |
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Introduction:
PUR hot melt glue binding mainframe pressure plate hot glue machine adopts Samsung 32-bit ARM7 series single chip microcomputer (CPU) for temperature and variable frequency motor program control, complete protection functions, precise and stable control, touch key input, 5.7-inch color LCD Chinese graphics Display, friendly operation interface.
Technical parameter:
Binding size |
Max: 450*320mm Min: 140*65mm |
Binding thickness |
1.5-45mm |
Binding speed |
2000books/hour |
Power required |
12kw |
Weight |
2100kg |
Dimensions |
3100*1330*1450mm |